Shuttle XB860G2 and XH810 Slim Systems Arrive with Intel Core Ultra 200 CPUs
Mar 22, 2026 — by Giorgio Mendoza 265 views
Shuttle has added two systems to its XPC slim lineup, the XB860G2 and XH810, both based on Intel Core Ultra 200 series processors. The systems are offered as compact barebone platforms for embedded, industrial, and general-purpose computing applications.
Both models use the LGA1851 socket and support Intel Core Ultra 200 series processors (Arrow Lake-S) with up to 65 W TDP. Each system supports up to 96 GB of DDR5-5600 memory across two SO-DIMM slots and includes integrated Intel Xe graphics with multi-display support.
— ADVERTISEMENT —
The two systems share a similar platform but differ in expansion capabilities, storage configuration, and chassis size.
XPC slim XB860G2 peripherals
The XPC slim XB860G2 uses a 4.5-liter chassis measuring approximately 237 × 200 × 95 mm. It includes a PCIe Gen5 x16 slot and an additional PCIe Gen4 x1 slot via a riser card, allowing installation of expansion cards within the compact enclosure.
XPC slim XB860G2 internal view
Storage options include three M.2 NVMe slots, one of which supports PCIe Gen5, along with a 2.5-inch SATA drive bay. Display outputs consist of HDMI 2.1 with 8K support, HDMI 2.0, and DisplayPort 1.4a.
The system provides dual Ethernet connectivity with 2.5 Gigabit and Gigabit interfaces. Power is supplied through an external 180 W adapter, and cooling is handled by a heatpipe-based system with dual 60 mm fans.
XPC slim XH810 peripherals
The XPC slim XH810 uses a 3.5-liter chassis measuring approximately 238 × 200 × 72.5 mm and supports two M.2 NVMe slots along with either two 2.5-inch drives or one 3.5-inch SATA drive. Display output is provided through HDMI 2.1, HDMI 2.0, and DisplayPort 1.4a.
XPC slim XH810 internal view
The system includes dual Ethernet with 2.5 Gigabit and Gigabit connectivity and supports multiple serial interfaces, with up to six COM ports for industrial or legacy connectivity. Power is provided by a 120 W external adapter, and cooling is implemented using a heatpipe-based design with dual fans.
| Feature | XH810 | XB860G2 |
|---|---|---|
| Processor | Intel Core Ultra 200 (LGA1851, up to 65 W) | Intel Core Ultra 200 (LGA1851, up to 65 W) |
| Chipset | Intel H810 | Intel B860 |
| Memory | Up to 96 GB DDR5-5600 | Up to 96 GB DDR5-5600 |
| Storage | 2× M.2 + 2× 2.5″ or 1× 3.5″ | 3× M.2 + 1× 2.5″ |
| PCIe Expansion | — | PCIe Gen5 x16 + Gen4 x1 |
| Networking | 2.5GbE + GbE | 2.5GbE + GbE |
| Display | HDMI 2.1 + HDMI 2.0 + DP 1.4a | HDMI 2.1 + HDMI 2.0 + DP 1.4a |
| Serial Ports | Up to 6× COM | Limited |
| Power Adapter | 120 W | 180 W |
| Chassis Volume | 3.5 L | 4.5 L |
| Dimensions | 238 × 200 × 72.5 mm | 237 × 200 × 95 mm |
Further Information
The product pages for the XPC slim XB860G2 and XH810 are available on the Shuttle website.
Please comment here...