At the core of this module lies the D9-Pro Chip with TSMC 16nm FinFET process with the following architecture:

• SemiDrive D9-Pro (D9360) — Six-core Arm Cortex-A55 (up to 1.6GHz); Single Arm Cortex-R5 (Up to 800MHz), dual-core Lock-step; 0.8 TOPS NPU; IMG PowerVR 9XM GPU (100 GFLOPS)

The MYC-JD9360 offers flexible memory and storage options, including 2GB LPDDR4 (expandable up to 4GB), 16GB eMMC storage (expandable up to 128GB), a 256Kbit EEPROM, and a 16MB QSPI Nor Flash.

   

The module is equipped with a 314-pin MXM 3.0 Gold-finger-edge-card connector that offers extensive connectivity options. It supports up to 135 GPIOs, 4x 12-bit ADC, 2x SDIO, 11x UART, 2x CAN FD, 4x I2C, 2x SPI, 1x JTAG, and various other interfaces.

There is also a compatible evaluation board available, offering versatile communication interfaces. These include 2x GbE (with TSN support), 2x RS232, 2x RS485, 2x USB 3.0 HOST ports, and M.2 sockets for expansion, among other features.

Specifications listed for the MYC-JD9360 CPU Module include:

• Memory/Storage:
  • 4GB/2GB LPDDR4
  • Up to GB eMMC
  • 256 Kbit EEPROM
  • 16 MB QSPI Nor Flash
• Display/Audio:
  • 1x MIPI-DSI
  • 2x LVDS
  • 4x Single-channel I2S/TDM
  • 2x Multi-channel I2S
• Camera:
  • 1x Parallel CSI
  • 1x MIPI CSI
• Connectivity:
  • 2x Gigabit Ethernet
• Expansion:
  • 2x PCIe3.0
• I/O Interfaces:
  • Up to 135x GPIOs
• USB:
  • 2x USB 3.0
• Other Features:
  • 1x JTAG
• Power:
  • 5V/5A
• Operating Temperature:
  • -40°C to 85°C 
• Mechanical:
  • 82mm x 45mm
  • 8-layer PCB design

Further information

The MYC-JD9360 CPU Module is priced at $65.00 while the development costs $159.00.