Seco’s Linux-friendly COM Express Basic Type 6 module supports 6th Gen Intel Core and Xeon processors and offers GbE, quad SATA, and triple display support.

Seco’s “COMe-B09-BT6” COM Express Basic Type 6 module is listed as “coming soon, and no photo is available, but a data sheet has been posted. Like Congatec’s Conga-TS170 Basic Type 6 entry and Adlink’s cExpress-SL (Compact) and Express-SL/SLE (Basic) Type 6 modules, but unlike most Skylake COM Express modules, the COMe-B09-BT6 runs Linux or Windows on Intel’s Skylake Xeons in addition other 14nm 6th Generation Core chips.

COMe-B09-BT6 rendering and block diagram
(click images to enlarge)

Processor support is identical to that of the Conga-TS170, except for the addition of a quad-core Xeon E3-1535M V5 clocked at 2.9GHz (3.8GHz turbo) with 8MB L2 cache and a 45W TDP. The COM offers a choice of Intel QM170, HM170, or CM236 companion chipsets, to handle the various Skylake processors’ I/O.

Specifically, these processors are available on the COMe-B09-BT6:

• Core i7-6820EQ — 4x 2.8GHz (3.5GHz turbo) cores, 8MB L2 cache; 45W TDP
• Core i7-6822EQ — 4x 2.0GHz (2.8GHz turbo) cores, 8MB L2 cache, 25W TDP
• Core i5-6440EQ — 4x 2.7GHz (3.4GHz turbo) cores, 6MB L2 cache, 45W TDP
• Core i5-6442EQ — 4x 1.9GHz (2.7GHz turbo) cores, 6MB L2 cache, 25W TDP
• Core i3-6100E — 2x 2.7GHz CPU cores, 3MB L2 cache, 35W TDP
• Core i3-6102E — 2x 1.9GHz CPU cores, 3MB L2 cache, 25W TDP
• Xeon E3-1505M V5 — 4x 2.8GHz (3.7GHz turbo) cores, 8MB L2 cache, 45W TDP
• Xeon E3-1535M V5 – 4x @ 2.9GHz (3.8GHz turbo), 8MB L2 cache, 45W TDP

Being compatible with COM Express Type 6 Basic specs, there’s nothing particularly unusual about Seco’s 125 x 95mm COMe-B09-BT6, which is not to say it may not be the best COM Express module for the job. And if you’re upgrading from, say, Seco’s 4th Gen Core “Haswell” based COMe-953-BT6 Type 6 Basic COM, the new module will seem pretty remarkable indeed. Skylake offers much better performance, graphics, and power efficiency, as well as features like fast DDR4 RAM.

The COMe-B09-BT6 supports up to two DDR4 RAM modules. No maximum capacity was listed, but this is presumably the same 32GB you would get from dual slots on the Conga-TS170. The module supplies three Digital Display Interfaces (DDIs), supporting DisplayPort 1.2, DVI, and HDMI 1.4. You also get dual-channel 18/24- bit LVDS, paired with either VGA or eDP. A PCI-Express Graphics (PEG) Gen3 x16 interface is available along with HD audio.

Other interfaces supplied to the COM Express bus include four SATA 3.0 interfaces, four USB 3.0 ports, and eight USB 2.0 ports, plus a Gigabit Ethernet interface implemented by means of an Intel I219-LM PHY. Additional I/O includes dual UART and SPI interfaces, plus single helpings of I2C, SMBus, and LPC bus. There are also eight GPIO lines and an optional TPM 1.2 security module. In addition to the aforementioned PCIe x16 (PEG) interface, the module also supplies eight PCIe x1 Gen 3 lanes to its bottom-mounted COM Express bus connectors.

Unlike the Adlink Skylake COMs, the COMe-B09-BT6 does not appear to be available with extended operating temperature support.

 
CCOMe-965 Mini-ITX format carrier

Like Seco’s recently announced COMe-A98-CT6 COM Express Type 6 Compact module, which features AMD Embedded R-Series (“Merlin Falcon”) SoCs, the COMe-B09-BT6 is supported with the open-spec CCOMe-965 Mini-ITX carrier board. The 170 x 170mm carrier features an ATX power connector.

CCOMe-965 (left) and block diagram
(click images to enlarge)

The CCOMe-965 is equipped with dual GbE and SATA ports, an mSATA slot, and four coastline USB 3.0 ports. All of the COMe-B09-BT6 module’s display interfaces are provided, along with a PCIe x4 slot, dual mini-PCIe slots, a SIM Card slot, and analog and digital SPDIF audio links. Several headers, as well as a 28-pin connector, handle additional I/O.

 
Further information

No pricing is available for the “coming soon” COMe-B09-BT6 module. More information may be found at Seco’s COMe-B09-BT6 product page.