[Update: Sep 20, 2017] — Octavo Systems has packed nearly all the functions of a BeagleBone Black SBC into a BGA module that only requires a few external components to boot Linux.

Much excitement has been generated in recent months by the introduction of a series of ever-smaller, low-cost single board computers. A few of these have included Inforce’s 85 x 54mm 6309 Micro SBC, Next Thing’s 60 x 40mm Chip, the Raspberry Pi Foundation’s 65 x 30mm Raspberry Pi Zero, and MediaTech’s 56 x 26mm LinkIt Smart 7688.

Now, Octavo Systems has taken this trend a major step further, by cramming nearly all the core functions of a complete BeagleBone Black Rev. C SBC into a single, chip-like BGA package that’s roughly the size of a quarter.

The chip-like OSD335x is roughly the size of a quarter
(click images to enlarge)

Within the OSD335x BGA package are three Texas Instruments active components: the AM335x processor, TPS65217C PMIC, and TL5209 LDO (low-drop-out) regulator. Additionally, the module integrates up to 1GB of DDR3 RAM along with more than 140 passive components, including resistors, capacitors, and inductors.

This level of integration reduces the size and complexity of an embedded design, says Octavo Systems. This “allows designers to focus on the key aspects of their system without spending time on the complicated high-speed design of the processor/DDR3 interface,” which “can significantly decrease the time to market for AM335x-based products.”

Simple (left) and detailed OSD335x SiP block diagrams

The OSD335x’s data sheet says the module’s 20 x 20 ball BGA footprint is a super-set of the TI AM3358 processor’s 18 x 18 BGA package footprint, with most of the signals of the TI AM3358 BGA package’s pins being mapped to the corresponding pins of the OSD335x’s BGA package. Presumably this similarity of signal assignment would ease the task of redesigning an existing AM335x-based board around the OSD335x. Assuming so, the higher integration of the OSD335x would allow for either a simplified, lower-cost board design or an increased density of on-board features.

Summary specifications listed for the OSD335x “system-in-package” module include:

• Processor — TI AM3358 or AM3352 SoC, including:
  • ARM Cortex-A8 CPU @ up to 1GHz
  • 8-channel 126-bit SAR ADC
  • 2x 10/100/1000 Ethernet
  • 2x USB 2.0 HS OTG + PHY
  • MMC, SD, SDIO, GPIO interfaces
  • 2x CAN interfaces
  • LCD controller and 3D graphics engine
  • PRU-ICSS (PRU x2), RTC, timers
• Internal RAM — up to 1GB DDR3
• TI TPS65217C power management and TL5209 LDO ICs
• External I/O — access to all AM335x GPIOs and peripherals
• Power:
  • Input — from USB or Li-Ion battery
  • Output — 1.8V, 3.3V, and SYS
• Package:
  • Footprint — 400-ball BGA (20 x 20) at 1.27mm pitch
  • Dimensions — 27 x 27mm
• Operating temperature 0 to 85°C; -40 to 85°C “coming soon”

 
OSD335x SBC reference design

To support development projects based on the OSD335x, Octavo Systems has released a detailed SBC reference design based on the module that implements a BeagleBone Black Rev C compatible design, both physically and functionally. In addition to the OSD335x BGA module, the SBC reference design appears to add several active components, including an eMMC flash storage chip, plus signal conditioning and power regulation components, and I/O connectors with functions and locations that match those of the standard BeagleBone Black.

OSD335x SBC Reference Design (left) vs. BeagleBone Black front views
(click images to enlarge)

Unlike most companies that offer chip-level embedded products, Octavo Systems currently has no plans to sell ready-to-use copies of its reference design. Instead, the company is working with a hardware partner (see farther below) that will offer its own board-level implementations — an SBC and a COM — based on the OSD335x. Additionally, Octavo is making its reference board schematics and PCB design files available for free download from its website, “for anybody to take and build their own,” a company representative explained in an email.


OSD335x SBC Reference Design (left) vs. BeagleBone Black back views
(click images to enlarge)

According to the OSD335x reference design’s application note, an embedded application that does not require all of the BeagleBone Black’s peripheral interfaces can eliminate many components “without impacting” the ability to run the BeagleBone Black’s standard Linux OS. Specifically, the application note states that the following minimal set of added components is required for booting a standard BeagleBone Black Linux build on an OSD335x-based design:

• OSD335x module, reset circuit, and power supply
• MicroSD card for development, eMMC for production
• USB PC (client) interface, for power input and Linux console port
• ID EEPROM (optional)
• Boot configuration for MicroSD card

As noted above, Octavo Systems hardware partner GHI Electronics has developed both an SBC development kit and a computer-on-module based on the OSD335x.

GHI Electronics OSD335x Development Board (left) and OSD335x System on Module
(click images to enlarge)

Both boards are currently listed on the GHI Electronics website as “preliminary,” with shipments expected to begin in “about 4 weeks.”

 
Further information

The Octavo Systems OSD335x system-in-package module will become available through DigiKey “early next week,” according to an email from the company. Pricing for the module with 512MB of RAM will list around $30 for 1K volumes. More details, including data sheets, application notes, and reference board schematics and PCB design files, may be found at the company’s OSD335x product page.