Compact SMARC module combines Linux, AI, and vision on i.MX 8M Plus
Feb 1, 2026
Variscite has introduced its first SMARC compatible SoM family with the VAR-SMARC-MX8M-PLUS, built around NXP’s i.MX 8M Plus processor. The module is designed for compact embedded and industrial systems that combine AI and vision processing with extended connectivity and integrated security.
Tria Technologies has launched the OSM-LF-IMX95, a compact Open Standard Module based on the NXP i.MX 95 applications processor. The module targets low-power edge and industrial systems that require high compute density, advanced security features, and flexible I/O in a small, solder-down form factor.
Baochip has previewed the Baochip-1x, a mostly open RTL, RISC-V–based microcontroller fabricated on TSMC’s 22 nm process. Designed with openness and verifiability in mind, the MCU integrates a VexRiscv application core running at up to 350 MHz, alongside a quad-core I/O accelerator cluster clocked at 700 MHz.
Espressif Systems has announced the ESP32-E22, its first Wi-Fi 6E connectivity co-processor and the starting point of a new product line targeting higher-performance wireless designs. The company positions the device as a radio co-processor that offloads Wi-Fi and Bluetooth networking functions from a host processor, allowing the host to focus on application-level tasks.
Renesas has introduced the RA6W1 and RA6W2 microcontrollers, bringing Wi-Fi 6 and Bluetooth LE options to its IoT portfolio. The RA6W1 offers dual-band Wi-Fi 6, while the RA6W2 adds integrated Bluetooth LE, both targeting low-power connected devices with features such as Target Wake Time to extend battery life.
Toradex has unveiled the OSM and Lino Computer on Module families, incorporating NXP’s i.MX 93 and i.MX 91 processors. These ultra-compact modules target high-volume industrial automation and edge systems, offering a rugged, cost-effective solution for space-constrained environments.
STMicroelectronics introduced the ST67W611M1 series earlier this year, a low power WiFi 6 and Bluetooth LE coprocessor family developed with Qualcomm Technologies. The modules are designed to add wireless connectivity to STM32 based systems and streamline support for emerging IoT standards such as Matter and Thread.
Diamond Technologies, Inc. has introduced three new OSM-based embedded computing modules: the DEC i.MX 91-OSM, DEC i.MX 93-OSM, and DEC MP2-OSM. Designed and supported in the United States, the modules expand the company’s embedded lineup with new processing, connectivity, and edge-level compute options.

wafer.space has launched its first pooled silicon fabrication run on Crowd Supply, known as GF180MCU Run 1. The campaign offers designers the opportunity to fabricate 1,000 chips of their own design using GlobalFoundries’ 180 nm mixed-signal process. The initiative is aimed at providing accessible, structured access to custom silicon, with dies expected to ship in March 2026.
Nordic Semiconductor has announced the nRF54LM20A, a high-memory addition to its nRF54L Series of ultra-low power wireless SoCs. Built on the company’s 22 nm technology platform, the device provides developers with more resources to design advanced Bluetooth LE and Matter products for consumer, industrial, and healthcare applications.
