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Compact SMARC module combines Linux, AI, and vision on i.MX 8M Plus

Feb 1, 2026

Variscite has introduced its first SMARC compatible SoM family with the VAR-SMARC-MX8M-PLUS, built around NXP’s i.MX 8M Plus processor. The module is designed for compact embedded and industrial systems that combine AI and vision processing with extended connectivity and integrated security.

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Tria launches Linux-ready OSM-LF-IMX95 45 × 45 mm module

Feb 1, 2026

Tria Technologies has launched the OSM-LF-IMX95, a compact Open Standard Module based on the NXP i.MX 95 applications processor. The module targets low-power edge and industrial systems that require high compute density, advanced security features, and flexible I/O in a small, solder-down form factor.

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Dabao Evaluation Board to Showcase Open-RTL Baochip-1x RISC-V MCU

Jan 25, 2026

Baochip has previewed the Baochip-1x, a mostly open RTL, RISC-V–based microcontroller fabricated on TSMC’s 22 nm process. Designed with openness and verifiability in mind, the MCU integrates a VexRiscv application core running at up to 350 MHz, alongside a quad-core I/O accelerator cluster clocked at 700 MHz.

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ESP32-E22 debuts with tri-band Wi-Fi 6E and dual-mode Bluetooth

Jan 19, 2026

Espressif Systems has announced the ESP32-E22, its first Wi-Fi 6E connectivity co-processor and the starting point of a new product line targeting higher-performance wireless designs. The company positions the device as a radio co-processor that offloads Wi-Fi and Bluetooth networking functions from a host processor, allowing the host to focus on application-level tasks.

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Renesas Releases Dual-Band Wi-Fi 6 and Bluetooth LE MCUs on Cortex-M33 Architecture

Dec 10, 2025

Renesas has introduced the RA6W1 and RA6W2 microcontrollers, bringing Wi-Fi 6 and Bluetooth LE options to its IoT portfolio. The RA6W1 offers dual-band Wi-Fi 6, while the RA6W2 adds integrated Bluetooth LE, both targeting low-power connected devices with features such as Target Wake Time to extend battery life.

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Toradex Introduces Coin-Sized Modules Powered with NXP i.MX 93 and i.MX 91 Processors

Dec 6, 2025

Toradex has unveiled the OSM and Lino Computer on Module families, incorporating NXP’s i.MX 93 and i.MX 91 processors. These ultra-compact modules target high-volume industrial automation and edge systems, offering a rugged, cost-effective solution for space-constrained environments.

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STMicroelectronics New WiFi 6/Bluetooth LE Coprocessor Modules Add Matter Support

Dec 4, 2025

STMicroelectronics introduced the ST67W611M1 series earlier this year, a low power WiFi 6 and Bluetooth LE coprocessor family developed with Qualcomm Technologies. The modules are designed to add wireless connectivity to STM32 based systems and streamline support for emerging IoT standards such as Matter and Thread.

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Diamond Technologies Adds New OSM Modules Based on i.MX 91, i.MX 93, and STM32MP2

Nov 22, 2025

Diamond Technologies, Inc. has introduced three new OSM-based embedded computing modules: the DEC i.MX 91-OSM, DEC i.MX 93-OSM, and DEC MP2-OSM. Designed and supported in the United States, the modules expand the company’s embedded lineup with new processing, connectivity, and edge-level compute options.

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Silicon Labs SixG301 Series 3 SoCs Target Zigbee, Matter, and Thread Development

Oct 21, 2025

Silicon Labs has announced general availability of its new Series 3 platform, debuting with the SiMG301 and SiBG301 wireless SoCs. Built on a 22 nm process, the Series 3 family targets compute-intensive IoT applications that require higher security, integrated connectivity, and support for modern 2.4 GHz wireless protocols.

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Astra SL2600 processors from Synaptics combine Arm cores and RISC-V Coral NPU

Oct 20, 2025

Synaptics has unveiled the Astra SL2600, a family of multimodal processors designed for edge computing across consumer, enterprise, and industrial IoT applications. The lineup debuts with the SL2610 product line, targeting low-power and high-performance designs used in smart home, automation, robotics, and retail systems.

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wafer.space Launches GF180MCU Run 1 for Custom Silicon Fabrication

Oct 2, 2025

wafer.space has launched its first pooled silicon fabrication run on Crowd Supply, known as GF180MCU Run 1. The campaign offers designers the opportunity to fabricate 1,000 chips of their own design using GlobalFoundries’ 180 nm mixed-signal process. The initiative is aimed at providing accessible, structured access to custom silicon, with dies expected to ship in March 2026.

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Nordic Semiconductor Expands nRF54L Series with High-Memory nRF54LM20A SoC

Sep 19, 2025

Nordic Semiconductor has announced the nRF54LM20A, a high-memory addition to its nRF54L Series of ultra-low power wireless SoCs. Built on the company’s 22 nm technology platform, the device provides developers with more resources to design advanced Bluetooth LE and Matter products for consumer, industrial, and healthcare applications.

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(Updated) LILYGO T-Embed CC1101: Enabling Sub-GHz and NFC/RFID Communication

Aug 10, 2025

LILYGO launched the T-Embed CC1101, built around the ESP32-S3 Dual-core LX7. It supports Wi-Fi, BLE 5, and Sub-GHz wireless communication, targeting remote and low-power IoT projects.

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Cortex-M23 Powers GigaDevice’s GD32C231 Series for Entry-Level Embedded Systems

Jun 12, 2025

GigaDevice has launched the GD32C231 series, a new line of 32-bit microcontrollers based on the Arm Cortex-M23 core. Designed for entry-level embedded applications, the series balances performance, power efficiency, and cost, particularly for compact or battery-powered products.

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