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Posts relating to Chips...

New Lantronix SIPs use Qualcomm QCS2290 and QCS4290 SoCs

Feb 15, 2023

Lantronix released this month two System-in-Package modules based on Qualcomm System-on-Chip Technology. The Lantronix Open-Q SIP modules are equipped with the Qualcomm Adreno GPU, LPDDR4 RAM, eMMC Flash storage, camera support, GNSS, Wi-Fi 5/BT 5.0 connectivity and many other peripherals.


Low-Power BLE/NFC modules support Azure RTOS and FreeRTOS

Jan 2, 2023

The CBT250 from CEL is a low power IoT module built around the QN9090 Bluetooth 5.0/NFC chipset from NXP Semiconductors. This module integrates a Cortex-M4 processor clocked at 48MHz and it also offers support for various interfaces such as I2C, SPI, UART, PWM, I2S, etc.


RISC-V news from T-Head Semiconductor and SiFive

Nov 6, 2022

Last week T-Head semiconductors announced their XuanTie C908 which implements a 9-stage pipeline along with an AI acceleration engine for AR/VR apps. Similarly, SiFive also shared details about their new P670/P470 RISC-V processors for wearables and smart consumer devices.


Multipurpose I/O module based on Raspberry Pi RP2040 silicon

Jun 15, 2022

Italian based Sfera Labs released the Iono RP D16 which is an I/O module driven by the RP2040 MCU suitable for industrial and commercial applications. This robust module provides sixteen digital 24V I/I lines and it’s CE, FCC and IC compliant.

BeagleBone AI-64 comes with TDA4VM SoC from Texas Instruments

Jun 14, 2022

The BeagleBoard community released a new BeagleBone board yesterday. The new model is called the BeagleBone AI-64 which builds on the BeagleBone AI SBC released a few years ago. The new Single Board Computer is equipped with the TDA4VM System on Chip (SoC) produced by Texas Instruments. (more…)

Texas Instruments introduces the AM62x SoCs to the Sitara processors family

Jun 13, 2022

Last week, Texas Instruments released two new models for the Sitara processor family. The Sitara AM623 and the AM625 can have up to four Cortex-A53 processors and one Arm Cortex M4F. For quick product development, TI is integrating them on the SK-AM62 starter kit which starts at $149.

MAYA-W2 Tri-Radio includes Wi-Fi 6, Bluetooth 5.2 and IEEE 802.15.4 support

May 14, 2022

The u-blox MAYA-W2 is a connectivity module based on the multiradio NXP IW612 chipset and provides support for standard wireless protocols such as Wi-Fi 6, Bluetooth 5.2 and 802.15.4. radio (Thread and Zigbee). (more…)

Qualcomm joins the Wi-Fi 7 competition with Networking Pro Series

May 5, 2022

A few days ago Qualcomm showcased their latest Wi-Fi 7 Networking Pro Series platforms that feature PHY data rates of 10.7, 16.5, 21.5 and 33 Gbps. According to Qualcomm, the Networking Pro 1620 SoC (System on Chip) can provide reliable and stable support for up to 2000 users. (more…)

POP32 & POP64 SiPs integrate SDRAM and Allwinner A33/A133 CPUs into compact IC design

Apr 23, 2022

Source Parts has recently posted info for the system in package (SiP) series called POPCAM (POP32 & POP64). The POP32 integrates the Allwinner A33 CPU and 128MB DDR3 while the POP64 integrates the Allwinner A133 CPU and 1GB LPDDR4.

Broadcom introduces world’s first Wi-Fi 7 chipset solutions

Apr 16, 2022

This week Broadcom announced their full end-to-end chipset solutions designed for Wi-Fi 7 applications that range from residential gateways, enterprise access points, client devices to Wi-Fi routers. Broadcom claims that these Wi-Fi 7 chips double the performance of Wi-Fi 6 and 6E solutions commercially available today. (more…)

ASRock Industrial release new range of industrial motherboards w/ 12th Gen Intel® Core Processors

Apr 11, 2022

The Taiwanese ASRock released a new line of industrial-grade motherboards equipped with Intel’s latest 12th Gen Core Processors (Alder-Lake-S) that feature 16-cores and 24 threads. ASRock expects their high-performance motherboards to be adopted in diverse applications i.e. smart cities, medical, Edge Artificial IoT, factory automation, kiosks, etc.

SolidRun & NXP launch World’s Smallest 16-Core System on Module

Apr 10, 2022

This past week, SolidRun released their newest LX2-Lite SoM based on the NXP’s Layerscape LX216A System on Chip as well as the CLEARFOG LX2-Lite off-the-shelf Development board. SolidRun claims that their LX2-Lite Mini SoM is the smallest 16-core SoM platform in the world due to 58x40mm ultra-compact footprint.

Compulab incorporates the NXP i.MX8M-Plus SoC to their SO-DIMM flexible design

Apr 8, 2022

The CL-SOM-iMX8PLUS is the latest SO-DIMM System on Module produced by Compulab and which aims to target industrial, medical and image/signal processing applications. This device integrates the i.MX8M-Plus SoC and the CL-SOM SO-DIMM to deliver optimum performance and large connectivity in a compact footprint.   


Nvidia unveils octa-core Jetson Orin NX and ships AGX Orin dev kit

Mar 23, 2022

Nvidia unveiled a scaled-down “Jetson Orin NX” sibling to its high-end AGX Orin module and officially launched its “Jetson AGX Orin Developer Kit.” The Orin NX is claimed to offer 3X the performance of the AGX Xavier.