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Efinix Sapphire RV64 brings 64-bit RISC-V and Linux to FPGAs

Oct 3, 2026

Efinix announced this week the Sapphire RV64, a configurable 64-bit RISC-V soft SoC intended for embedded Linux, edge AI and other applications requiring more memory and processing capability than the company’s existing 32-bit Sapphire architecture. The processor can be implemented across Efinix Titanium and Topaz FPGAs, as well as Trion devices from the T20 upward.

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16-TOPS AI SBC with SATA 3.0 runs on octa-core Sophgo BM1688

Sep 23, 2026

Orange Pi has published hardware details for the OrangePi O1, a 90 × 70mm SBC based on the Sophgo BM1688 processor. It pairs eight Arm Cortex-A53 cores with a RISC-V C906 coprocessor and a 16-TOPS INT8 TPU, along with up to 16GB of LPDDR4/LPDDR4X memory.

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nRF54LC10A SoC features Cortex-M33, RISC-V coprocessor, Bluetooth LE, Thread and Zigbee

Sep 17, 2026

Nordic Semiconductor has expanded its nRF54L Series with the nRF54LC10A, an entry-level multiprotocol SoC aimed at compact, cost-sensitive IoT devices. The chip integrates a 128MHz Arm Cortex-M33, a 128MHz RISC-V coprocessor, 1MB of non-volatile memory, 192KB of RAM, and a 2.4GHz radio supporting Bluetooth LE, Thread, Zigbee, Matter, and proprietary protocols.

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Coin-sized Radxa rCore-Q8550 module features 48-TOPS NPU and PCIe Gen 4

Sep 17, 2026

Described by Radxa as its flagship edge AI module, the rCore-Q8550 targets robotics and machine vision with the Qualcomm Dragonwing QCS8550 platform and an optional Hexagon AI processor delivering up to 48 Dense INT8 TOPS. The 36 x 32mm module also supports up to 16GB of LPDDR5X, 128GB of UFS 3.1 storage, PCIe Gen 4, and six four-lane MIPI-CSI interfaces.

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CompuLab i.MX952 Linux-capable module showcases 2.5GbE, Wi-Fi 6 and PCIe Gen 3

Sep 17, 2026

CompuLab has introduced the UCM-iMX952, a 28 x 40mm System-on-Module based on NXP’s i.MX952 processor. The module supports up to 16GB of LPDDR5 or LPDDR4X memory and 128GB of eMMC storage, along with PCIe Gen 3, 2.5GbE, Wi-Fi 6, Bluetooth 5.4, and multiple display and camera interfaces.

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Tiny OSM-MF module runs Linux on Sitara AM67 and 4-TOPS AI

Sep 3, 2026

Ezurio has announced the Carbon AM67 OSM-MF, a compact solder-down module based on Texas Instruments’ Sitara AM67x processor family. The module offers heterogeneous Arm processing, up to 8GB LPDDR4, eMMC storage, 4-TOPS AI acceleration, multi-display and camera support, dual Gigabit Ethernet, and optional Wi-Fi 6 or Wi-Fi 6E connectivity.

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Embedded platform implements Amlogic A311Y3 octa-core SoC with PCIe 3.0 support

Sep 1, 2026

Boardcon’s CM311Y3 system-on-module and accompanying Idea311Y3 development board are based on the Amlogic A311Y3 processor. The platform provides an 8-TOPS NPU, up to 16GB of LPDDR5/LPDDR5X memory, PCIe 3.0 storage expansion, dual Gigabit Ethernet, HDMI input and output, and multiple MIPI camera and display interfaces.

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Fanless Edge box runs Linux on Rockchip RV1126B with 3-TOPS NPU

Aug 24, 2026

The Forlinx FCU3101 is a fanless edge AI computing system based on Rockchip’s RV1126B/RV1126BJ processor, providing local AI inference, Ethernet, serial, and digital I/O connectivity for industrial vision, security monitoring, and data acquisition applications.

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nRF93M1 DK with LTE Cat 1 bis, nRF54L15, and nRF Cloud support

Aug 18, 2026

Nordic Semiconductor’s nRF93M1 Development Kit is now available through multiple distributors, providing a platform for evaluating the company’s nRF93M1 LTE Cat 1 bis cellular module. The board combines the modem with an nRF54L15 host MCU and includes USB-C, onboard J-Link debugging, power-measurement support, and a preloaded SIM card.

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Comu Fits a 144MHz CH32V203 RISC-V Board Inside a USB-A Port

Aug 5, 2026

Tindie recently listed Comu, a compact development board built around the WCH CH32V203 RISC-V microcontroller. Measuring 13 × 9.4mm, the board fits inside a USB-A port and combines programmable touch controls, LEDs, USB device support, and access to several GPIO signals.

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Espressif begins mass production of ESP32-S31 wireless RISC-V SoC

Jul 28, 2026

Espressif has moved the ESP32-S31 into mass production, expanding its wireless microcontroller lineup with a dual-core RISC-V processor, Wi-Fi 6, Bluetooth 5.4, Bluetooth Classic, and IEEE 802.15.4 connectivity. The new SoC targets smart-home hubs, audio devices, industrial automation, edge AI systems, and other connected applications requiring higher processing and wireless performance.

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ESP32-S31 development boards bring Wi-Fi 6, audio, camera, and HMI features

May 24, 2026

Earlier announced in March with the unveiling of the ESP32-S31 SoC, Espressif has now launched the ESP32-S31-Korvo-1 multimedia development board, while documentation additionally references the ESP32-S31-Function-CoreBoard-1 connectivity-oriented board. Both platforms are built around the ESP32-S31-WROOM-3 module and target multimedia, audio, display, and connected IoT applications.

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Rockchip unveils RK3572 processor with 4 TOPS NPU and LPDDR5X support

May 17, 2026

The newly announced RK3572 by Rockchip is an octa-core processor targeting AIoT, edge computing, and embedded applications. Built on an 8nm process, it features dual Cortex-A73 cores, six Cortex-A53 cores, a 4 TOPS NPU, Mali-G310 GPU, LPDDR5/LPDDR5X support, and 8K video decoding.

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SpacemiT K3 integrates 8-core RISC-V CPU cluster and 60 TOPS AI engine

May 10, 2026

SpacemiT’s Key Stone K3 is a high-performance RISC-V SoC designed for AI and edge computing applications. The processor combines eight X100 64-bit RISC-V CPU cores with eight A100 AI-oriented compute cores, along with multimedia, networking, and high-speed I/O support targeting edge and embedded AI workloads.

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