Lantronix released this month two System-in-Package modules based on Qualcomm System-on-Chip Technology. The Lantronix Open-Q SIP modules are equipped with the Qualcomm Adreno GPU, LPDDR4 RAM, eMMC Flash storage, camera support, GNSS, Wi-Fi 5/BT 5.0 connectivity and many other peripherals.

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The CBT250 from CEL is a low power IoT module built around the QN9090 Bluetooth 5.0/NFC chipset from NXP Semiconductors. This module integrates a Cortex-M4 processor clocked at 48MHz and it also offers support for various interfaces such as I2C, SPI, UART, PWM, I2S, etc.

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Last week T-Head semiconductors announced their XuanTie C908 which implements a 9-stage pipeline along with an AI acceleration engine for AR/VR apps. Similarly, SiFive also shared details about their new P670/P470 RISC-V processors for wearables and smart consumer devices.

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Italian based Sfera Labs released the Iono RP D16 which is an I/O module driven by the RP2040 MCU suitable for industrial and commercial applications. This robust module provides sixteen digital 24V I/I lines and it’s CE, FCC and IC compliant.
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The BeagleBoard community released a new BeagleBone board yesterday. The new model is called the BeagleBone AI-64 which builds on the BeagleBone AI SBC released a few years ago. The new Single Board Computer is equipped with the TDA4VM System on Chip (SoC) produced by Texas Instruments. (more…)

Last week, Texas Instruments released two new models for the Sitara processor family. The Sitara AM623 and the AM625 can have up to four Cortex-A53 processors and one Arm Cortex M4F. For quick product development, TI is integrating them on the SK-AM62 starter kit which starts at $149.
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The u-blox MAYA-W2 is a connectivity module based on the multiradio NXP IW612 chipset and provides support for standard wireless protocols such as Wi-Fi 6, Bluetooth 5.2 and 802.15.4. radio (Thread and Zigbee). (more…)

A few days ago Qualcomm showcased their latest Wi-Fi 7 Networking Pro Series platforms that feature PHY data rates of 10.7, 16.5, 21.5 and 33 Gbps. According to Qualcomm, the Networking Pro 1620 SoC (System on Chip) can provide reliable and stable support for up to 2000 users. (more…)

Source Parts has recently posted info for the system in package (SiP) series called POPCAM (POP32 & POP64). The POP32 integrates the Allwinner A33 CPU and 128MB DDR3 while the POP64 integrates the Allwinner A133 CPU and 1GB LPDDR4.
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This week Broadcom announced their full end-to-end chipset solutions designed for Wi-Fi 7 applications that range from residential gateways, enterprise access points, client devices to Wi-Fi routers. Broadcom claims that these Wi-Fi 7 chips double the performance of Wi-Fi 6 and 6E solutions commercially available today. (more…)

The Taiwanese ASRock released a new line of industrial-grade motherboards equipped with Intel’s latest 12th Gen Core Processors (Alder-Lake-S) that feature 16-cores and 24 threads. ASRock expects their high-performance motherboards to be adopted in diverse applications i.e. smart cities, medical, Edge Artificial IoT, factory automation, kiosks, etc.
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This past week, SolidRun released their newest LX2-Lite SoM based on the NXP’s Layerscape LX216A System on Chip as well as the CLEARFOG LX2-Lite off-the-shelf Development board. SolidRun claims that their LX2-Lite Mini SoM is the smallest 16-core SoM platform in the world due to 58x40mm ultra-compact footprint.
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The CL-SOM-iMX8PLUS is the latest SO-DIMM System on Module produced by Compulab and which aims to target industrial, medical and image/signal processing applications. This device integrates the i.MX8M-Plus SoC and the CL-SOM SO-DIMM to deliver optimum performance and large connectivity in a compact footprint.   

Nvidia unveiled a scaled-down “Jetson Orin NX” sibling to its high-end AGX Orin module and officially launched its “Jetson AGX Orin Developer Kit.” The Orin NX is claimed to offer 3X the performance of the AGX Xavier.
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