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Gowin Semiconductor and Andes Technologies have recently unveiled the specifications for their AndesCore A25 RISC-V CPU IP along with the AE350 peripheral subsystem integrated into the GW5AST-138 GOWIN FPGA from the Arora V family.
AnalogLamb is set to release three affordable RISC-V breakout boards. These boards are based on the CHV32 Series microcontrollers offering support for standard interfaces such as I2C, SPI, UART, CAN, DMA, among others.
The MicroGEA STM32MP13 is a small embedded product based on one of the latest STM32 processors designed for wearables and low-powered consumer applications. Additionally, the device is industrial qualified and supports Linux operating systems. (more…)
Texas Instruments recently launched two development kits based on the CC2340R5 and the CC1314R10 wireless microcontrollers. These Launchpads support protocols such as Bluetooth 5 Low Energy, Sub-1 GHz, Wi-SUN, etc.
MYIR launched today a CPU module based on the Renesas RZ/G2L System-on-Chip optimized for HMI, IoT and embedded devices with video capabilities. The MYC-G2LX CPU module is equipped with up to 2GB DDR4, 8GB eMMC and support for Linux.
This month, RAKwireless launched a LoRa/BLE5 module based on the Ambiq Apollo3 Blue SoC and the Semtech SX1262 optimized for IoT applications. These new RAK11720 modules start at $7.99 and are compatible with Arduino programming.
Lantronix released this month two System-in-Package modules based on Qualcomm System-on-Chip Technology. The Lantronix Open-Q SIP modules are equipped with the Qualcomm Adreno GPU, LPDDR4 RAM, eMMC Flash storage, camera support, GNSS, Wi-Fi 5/BT 5.0 connectivity and many other peripherals.
The CBT250 from CEL is a low power IoT module built around the QN9090 Bluetooth 5.0/NFC chipset from NXP Semiconductors. This module integrates a Cortex-M4 processor clocked at 48MHz and it also offers support for various interfaces such as I2C, SPI, UART, PWM, I2S, etc.
Last week T-Head semiconductors announced their XuanTie C908 which implements a 9-stage pipeline along with an AI acceleration engine for AR/VR apps. Similarly, SiFive also shared details about their new P670/P470 RISC-V processors for wearables and smart consumer devices.
Italian based Sfera Labs released the Iono RP D16 which is an I/O module driven by the RP2040 MCU suitable for industrial and commercial applications. This robust module provides sixteen digital 24V I/I lines and it’s CE, FCC and IC compliant.
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The BeagleBoard community released a new BeagleBone board yesterday. The new model is called the BeagleBone AI-64 which builds on the BeagleBone AI SBC released a few years ago. The new Single Board Computer is equipped with the TDA4VM System on Chip (SoC) produced by Texas Instruments. (more…)
Last week, Texas Instruments released two new models for the Sitara processor family. The Sitara AM623 and the AM625 can have up to four Cortex-A53 processors and one Arm Cortex M4F. For quick product development, TI is integrating them on the SK-AM62 starter kit which starts at $149.
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The u-blox MAYA-W2 is a connectivity module based on the multiradio NXP IW612 chipset and provides support for standard wireless protocols such as Wi-Fi 6, Bluetooth 5.2 and 802.15.4. radio (Thread and Zigbee). (more…)
A few days ago Qualcomm showcased their latest Wi-Fi 7 Networking Pro Series platforms that feature PHY data rates of 10.7, 16.5, 21.5 and 33 Gbps. According to Qualcomm, the Networking Pro 1620 SoC (System on Chip) can provide reliable and stable support for up to 2000 users. (more…)