IBASE has announced the IB966, a 3.5-inch SBC based on Intel Core Ultra Series 3 “Panther Lake” processors, with up to 180 TOPS of aggregate AI performance, 128GB of DDR5-7200 memory, dual 2.5GbE and three M.2 slots.

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Featuring the quad-core Allwinner H618, the BPI-CM7 is a low-profile compute module with onboard LPDDR4 memory, eMMC storage, Wi-Fi 5, and Bluetooth 5.0. The module uses two 100-pin board-to-board connectors and is designed to work with Banana Pi’s BPI-CM7IO carrier board, which provides access to multiple peripheral interfaces.

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Shenzhen Graperain Technology has featured an Allwinner A733 development platform with a gold-finger system-on-module and carrier board. It provides an octa-core Arm processor, 3-TOPS NPU, LPDDR5 memory, M.2 storage, GbE and multiple display and camera interfaces.

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ASRock Industrial has announced four compact platforms based on Intel Core Series 3 “Wildcat Lake-U” processors. The lineup includes the NUC BOX-320 and NUC BOX-304 mini PCs, alongside the NUC-320 and NUC-304 motherboards, with up to 40 TOPS of AI performance, DDR5 memory, dual 2.5GbE networking, and multi-display support for embedded applications.

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ARK Electronics recently showcased the ARKV6X-RT, an NDAA-compliant flight controller based on the FMUV6X-RT and Pixhawk Autopilot Bus open standards. The module uses an NXP i.MX RT1176 microcontroller and includes three synchronized IMUs, onboard FRAM, a secure element and PX4 Autopilot support.

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Orange Pi has published hardware details for the OrangePi O1, a 90 × 70mm SBC based on the Sophgo BM1688 processor. It pairs eight Arm Cortex-A53 cores with a RISC-V C906 coprocessor and a 16-TOPS INT8 TPU, along with up to 16GB of LPDDR4/LPDDR4X memory.

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SECO has added two compact industrial platforms based on Qualcomm’s Dragonwing IQ-2390 processor: the Compact Vision 5 Dragonwing IQ-2390, a 5-inch panel-mounted HMI, and the SBC-Dragonwing-IQ-2390, a 47 × 114mm single-board computer for custom embedded systems. Both platforms support on-device AI, industrial connectivity and SECO’s Yocto Linux-based Clea OS.

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Described by Radxa as its flagship edge AI module, the rCore-Q8550 targets robotics and machine vision with the Qualcomm Dragonwing QCS8550 platform and an optional Hexagon AI processor delivering up to 48 Dense INT8 TOPS. The 36 x 32mm module also supports up to 16GB of LPDDR5X, 128GB of UFS 3.1 storage, PCIe Gen 4, and six four-lane MIPI-CSI interfaces.

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CompuLab has introduced the UCM-iMX952, a 28 x 40mm System-on-Module based on NXP’s i.MX952 processor. The module supports up to 16GB of LPDDR5 or LPDDR4X memory and 128GB of eMMC storage, along with PCIe Gen 3, 2.5GbE, Wi-Fi 6, Bluetooth 5.4, and multiple display and camera interfaces.

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Mecha’s Comet is a modular Linux handheld built around a 3.92-inch AMOLED touchscreen and offered with either an NXP i.MX8M Plus or i.MX95 processor, along with expandable storage, Wi-Fi 6, Bluetooth 5.4, and a magnetic 40-pin interface for keyboard, gamepad, and GPIO extensions. The handheld also provides USB-C connectivity, an 8MP camera, M.2 expansion, and a 4100mAh battery.

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LattePanda has expanded its x86 compute module lineup with the Mu Ultra, a compact device based on Intel Core Ultra 200V “Lunar Lake” processors. The module is offered with Core Ultra 5 226V and Core Ultra 7 256V options, up to 115 TOPS of combined INT8 AI performance, 16GB of LPDDR5X memory, PCIe 4.0 expansion, and support for Windows 11 and Ubuntu.

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MYIR’s MYC-JMX95X is a SMARC 2.2 System-on-Module based on NXP’s i.MX95 processor. The module features six Cortex-A55 cores, Cortex-M7 and Cortex-M33 auxiliary cores, a 2-TOPS NPU, LPDDR5 memory, eMMC storage, Wi-Fi 6, Bluetooth 5.4, and a range of high-speed expansion interfaces.

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Hardkernel has spun its ODROID-M1S into a Lite version, offering a lower-cost configuration of the RK3566-based single-board computer. The board includes 2GB of LPDDR4 memory, soldered eMMC storage, Gigabit Ethernet, HDMI 2.0, MIPI-DSI, USB 3.0, an M.2 NVMe slot, and Ubuntu support.

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Ezurio has announced the Carbon AM67 OSM-MF, a compact solder-down module based on Texas Instruments’ Sitara AM67x processor family. The module offers heterogeneous Arm processing, up to 8GB LPDDR4, eMMC storage, 4-TOPS AI acceleration, multi-display and camera support, dual Gigabit Ethernet, and optional Wi-Fi 6 or Wi-Fi 6E connectivity.

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