The Raspberry Pi Foundation launched yesterday a new tiny platform based on the RP2040 silicon. The new device is called the Raspberry Pi Pico W and it provides connectivity by integrating the CYW43439 Wi-Fi/Bluetooth module from Infineon.

Vecow presented their new line of System on Module devices (SoM) at Embedded World 2022. The latest SoMs integrate MediaTek’s Genio 1200, Genio 500 and Genio 350 processors. Additionally, the company has developed carrier boards for quick product development.

ICOP recently released a 3.5” Single Board Computer (SBC) that implements the 32-bit Vortex86DX3 System on Chip (SoC). The VDX3-6726 SBC was designed with comprehensive backwards compatibility to support older software and extend the life cycle of existing products without the need of complex redesign.

The STEPFPGA MXO2Core is a compact platform based on the Lattice MX02-4000 FPGA. The low cost device is loaded with several I/O peripherals and it’s targeted towards FPGA beginners. The STEPFGA costs around $46 through a Kickstarter campaign that already surpassed its funding goal.

The IOT-GATE-IMX8PLUS is an IoT gateway made by Compulab that is based on the NXP i.MX.8M Plus System on Chip (SoC) for commercial or industrial applications. The device features dual GbE ports, Wi-Fi6/BLE 5.3 support, LTE 4G, GPS and many optional peripherals.

Holybro has revealed two new models of the popular Pixhawk flight controller for Unmanned Aerial Vehicles (UAVs). The Pixhawk 6X and the Pixhawk 6C use a Cortex-M7 as Flight Management Unit (FMU) and a Cortex-M3 as an I/O processor.

This week, the non-profit global organization OpenHW presented a RISC-V based development board at Embedded World 2022. The Core-V MCU dev kit integrates a 32-bit CV32E40P open source RISC-V core and the ArticPro eFPGA from QuickLogic.

Following the introduction of the Persee+ 3D embedded camera in April 2022, Orbbec has released a complete new line of 3D cameras optimized to capture static or moving objects and scenes with superior accuracy. The company ensured the Femto ToF 3D cameras are enabled to be used in applications including healthcare, robotics, augmented reality and more.

SolidRun announced today a partnership with Renesas Electronics at Embedded World. According to SolidRun, the RZ/G2LC is the first System on Module (SOM) based on the 64-bit RZ/G2LC System on Chip from Renesas. The company is expecting to target applications such as IoT solutions, video surveillance, HMI applications and industrial automation solutions. 

AAEON has announced a few new products ahead of Embedded World 2022. The NanoCOM-TGU and COM-ICDB7 are COM Express modules that feature Intel’s Tiger Lake UP3 SoC processor and Intel’s SoC Xeon D LCC processor respectively.

SparkFun has unveiled a data logging module compatible with their own Thing Plus devices. The SparkFun Thing Plus Dual-Port Logging Shield features an ATtiny841 MCU which allows the user to interface with a microSD card through SPI or USB-C.

MediaTek released a System on Module (SoM) that integrates their latest Genio 1200 AIoT (MT8395) System on Chip showcased last month. The LEC-MTK-I1200 features 8-cores (4x Cortex-A78/4x A55), 5-cores Arm Mali-G57 GPU and an APU system (5 TOPS). For quick prototyping, ADLINK has also designed a development board compatible with the LEC-MTK-I1200.

Ibase released a 3.5” single board computer (SBC) that is powered by the 11th Gen Intel Core processors (Tiger Lake H). The high performance IB956 SBC has quad-displays, dual GbE ports and dual SATA III.

Italian based Sfera Labs released the Iono RP D16 which is an I/O module driven by the RP2040 MCU suitable for industrial and commercial applications. This robust module provides sixteen digital 24V I/I lines and it’s CE, FCC and IC compliant.