All News | Boards | Chips | Devices | Software | LinuxDevices.com Archive | About | Contact | Subscribe
Follow LinuxGizmos:
Twitter Google+ Facebook RSS feed
> get email updates <

Rugged COM Express Type 6 modules adopt Skylake and Braswell

Jun 30, 2016 — by Eric Brown — 295 views
Tweet about this on TwitterGoogle+Share on FacebookShare on LinkedInShare on RedditPin on Pinterest

Win Enterprises unveiled a COM Express Compact module for Intel Braswell, following two COM Express releases for Skylake. They all operate from -40 to 85°C.

The Win Enterprises MB-73450 is a 95 x 95mm COM Express Type 6 Compact computer-on-module that supports Intel Pentium and Celeron N3000, as well as Intel Atom x5-E8000, system-on-chips from the 14nm “Braswell” family. The module is the third in a new wave of Win Enterprises COM Express modules with Intel chips released in recent months.



Two views of the MB-73450
(click images to enlarge)

Farther below you can read about the MB-73430, a 125 x 95mm COM Express Type 6 Basic and the MB-73440, a COM Express Type 6 Compact. Each is built around 6th Generation Intel Core “Skylake” processors, with the MB-73430 tapping the high-end EQ models and the MB-73440 using more power-efficient U-Series Core and Celeron chips.

Win Enterprises, which has a Taipei manufacturing partner called Aewin Technologies, is better known for its Mini-ITX SBCs than for COMs. The only other COM Express model listed by Win Enterprises is an MB-62020, which runs an old Atom Z530.

All three of the new COM Express modules from Win Enterprises support standard 0 to 60°C and optional -40 to 85°C temperatures. They also provide a wide range voltage input of 8.5 to 20V. No OS support was listed, but the modules should work fine with a variety of Linux and Windows distributions.

 
MB-73450

Since the Intel Braswell introduction over a year ago, a number of embedded vendors have tapped the 14nm-fabricated chips for COM Express modules.

Like most of these, the MB-73450 supports several dual- and quad-core Pentium and Celeron N3000 SoCs, as well as the more recent, Braswell-based, quad-core Atom x5-E8000, with low TDPs ranging from 4W to 6W.



MB-73450 Intel CPU choices
(click image to enlarge)

Win Enterprises praises the Atom x5-E8000 for its “excellent turbo-boost characteristics,” which support compute-intense activities such as security key handling with encryption/de-encryption, managing network traffic, and virus protection. The 5W TDP x5-E8000 is indeed unusual for its wide turbo boost range, letting it jump from 1.04GHz to 2GHz.

The MB-73450 supports up to 8GB of dual-channel DDR3L RAM and provides two 6Gbps SATA III interfaces for storage. The module has an Intel i210LM GbE (Gigabit Ethernet) controller, as well as wo DDI channels and an LVDS interface, supporting up to three independent displays.

The MB-73450 supports four USB 3.0 ports, eight USB 2.0 ports, two 2-wire COM ports, and five PCIe x1 (Gen2) expansion interfaces. Other features include Intel HD audio, SPI, LPC, I2C, SMBus, 8-bit GPIO, smart fan, and optional TPM 1.2/2.0. The module provides 3.5 Grms vibration resistance in addition to the optional industrial temperature support.
 
MB-73430
The recently introduced MB-73430 has the larger 125 x 95mm Basic footprint of the COM Express Type 6 form factor. The module supports dual- and quad-core Intel Core i7/i5/i3 CPUs of the 14nm 6th Generation, focusing on high-end EQ series chips with TDPs ranging from 25W to 45W. The chips include Intel Gen9 HD Graphics, which supports advanced graphics and video, such as HEVC (H.265) encoding and 4K video conferencing. The EQ series chips, which are found on modules such as Seco’s COMe-B09-BT6 Type 6 COM, are offered with QM170 companion chipsets.



MB-73430
(click image to enlarge)

The MB-73430 supports up to 32GB dual-channel DDR4 RAM, and has four SATA III interfaces and a GbE (Intel i219LM) controller. Three DDI channels and an LVDS interface combine to support up to three independent displays.


MB-73430 CPU options
(click image to enlarge)

The MB-73430 provides for up to four USB 3.0 ports, eight USB 2.0 ports, two 2-wire COM ports, and eight PCIe x1 (Gen2) expansion interfaces configurable as x4 or x2. There’s also a PCIe x16 link with multiple configuration choices. Other features include Intel HD audio, SPI, LPC, I2C, SMBus, 8-bit GPIO, smart fan, and optional TPM 1.2/2.0 security.

 
MB-73440

Whereas the MB-7430 supports higher-power EQ series Intel Core chips, the MB-73440 is made for more power-efficient, dual-core U series 6th Gen Core chips. This 95 x 95mm Type 6 Compact module also supports a related Celeron 3955U processor, which similarly runs at a 15W TDP.



MB-73440
(click image to enlarge)

The MB-73440 supports up to 32GB dual-channel DDR4 RAM, and has two SATA III interfaces and an optional onboard SSD. There’s also a GbE (Intel i219LM) controller. Two DDI channels and an LVDS interface combine to drive up to three independent displays.


MB-73440 CPU options
(click image to enlarge)

The MB-73440 can enable carrier boards with four USB 3.0 ports, eight USB 2.0 ports, a single COM port, and five PCIe x1 expansion interfaces. Other features include Intel HD audio, SPI, LPC, I2C, SMBus, 8-bit GPIO, smart fan, and optional TPM 1.2. Like the Braswell-based MB-73450, it offers 3.5 Grms vibration resistance, and like the MB-73450 and MB-73430 it provides an optional industrial temperature range.

 
Further information

No pricing or availability information was provided for the new MB-73450 (Braswell), as well as MB-73430 and MB-73440 (Skylake) COM Express Type 6 modules. Customization is available in OEM quantities. More information may be found at the Win Enterprise product pages for the MB-73450, the MB-73430, and the MB-73440.
 

(advertise here)


Print Friendly, PDF & Email
PLEASE COMMENT BELOW

Please comment here...