Hectronic will soon begin sampling a Linux-compatible Qseven computer-on-module based on AMD’s dual-core, 1GHz G-Series SoC. Claimed as the first Qseven COM to use the new AMD SoC, the H6069 is equipped with 2GB of soldered DDR3 RAM and an optional 32GB SSD, and features dual display support, 12 Watt power consumption, and optional industrial temperature range operation.
According to Hectronic, the H6069 is the first Qseven COM to ship with AMD’s new Embedded G-Series SoCs, which in turn are the first AMD G-Series parts to integrate on-chip I/O controllers along with CPUs and GPUs (graphics processing units). The G-Series SoC can be found in a Congatec COM Express module called the Conga-TCG, and has appeared in several single board computers (SBCs), including the Win Enterprises 3.5-inch MB-60830, but this may indeed be the first Qseven implementation.
Hectronic H6069 Qseven COM based on AMD’s G-Series SoC
(click image to enlarge)
The G-Series system-on-chip integrates a new, faster, 28nm-fabricated “Jaguar” x86-based CPU, and doubles shared L2 cache to 2MB. There’s also a faster new Radeon 8400-series GPU with OpenCL support. Hectronic uses the dual-core GX-210HA model, clocked to 1GHz, with a 9 Watt TDP, leading to a power draw for the H6069 of 12 Watts, says the company.
The H6069 complies with the SGET Qseven 2.0 standard, and measures the usual 70 x 70mm. Target applications include digital signage, high-end HMIs, portable test and measurement, as well as imaging and vision systems based on high-end cameras, says Sweden-based Hectronic.
The module ships with 2GB of soldered DDR3 RAM, with an option to move up to 4GB. Also optional is a 32GB NAND solid state drive (SSD) that uses one of the four available SATA interfaces. Additional customizations are also available, says the company.
A gigabit Ethernet controller is onboard, and I/O is expressed via the Qseven form-factor’s high-density 230-pin MXM edge connector. Dual displays are supported, with dual 24-bit LVDS interfaces as well as a choice of DisplayPort, DVl, HDMI ports.
The module supplies two USB 3.0 ports, four USB 2.0 ports, an SDIO connection, as well as LPC and serial I2C interfaces. Four PCI Express x1 interfaces are also available. An industrial temperature option will follow in March 2014, says Hectronic.
Hectronic has crafted its own BIOS for the module based on the Phoenix SecureCore UEFI BIOS. BSPs are available for Linux, as well as various Windows flavors.
Specifications listed for the H6069 include:
- Processor — AMD Embedded G-Series SOC (GX-210HA) with 2x Jaguar/x86 cores @ 1GHz, Fusion I/O controller, and AMD Radeon 8400 GPU
- Memory — 2GB soldered DDR3 RAM, expandable to 4GB; optional soldered 32GB SATA NAND SSD
- Networking — gigabit Ethernet controller (Intel 82583)
- Other I/O (via Qseven MXM connector):
- Dual 24-bit LVDS
- DisplayPort or DVI or HDMI
- 4x USB 2.0
- 2x USB 3.0
- LPC bus
- 3x SATA (4x if no onboard SSD)
- Serial — provides support for super I/O chips on carrier board
- I2C/SM interface
- Audio I/O — supports HDA audio codec on carrier board
- 4x PCIe x1
- Power — +5V +/-5%; 12W max. consumption; ACPI 3.0b compliant (support for S3 and S4); Smart battery support
- Operating temperature — 0 to 60°C; industrial (-40 to 85°C) version due in March 2014
- Operating system — BSPs for Linux, Windows XP Embedded, Windows Embedded Standard 7, Windows Embedded 8
Although Hectronic mentions carrier board support for the H6069, the only carrier board currently available for use with the H6069 COM is the company’s existing Qseven-compatible H4103 carrier board (shown at the right; click to enlarge). However, the H4103 is Qseven v1.2 — not v2 — compatible, with the result that some H6069 features, such as USB 3.0, are not supported. A new Qseven 2.0-compatible baseboard for the H6069 COM is expected to be available “within some months’ time,” says the company.
The H6069 module will begin early access sampling to key OEM customers on Dec. 10. More information may be found at the Hectronic H6069 product page.