Kontron announced a Linux-friendly “COMe-cTL6” COM Express Compact Type 6 module and “VX3060” VPX blade with Intel’s 11th Gen Tiger Lake CPUs. A 3.5-inch SBC is in the works.

Hailo has launched a line of M.2 and mini-PCIe cards for Linux systems equipped with its up to 26-TOPS, 3-TOPS per Watt Hailo-8 NPU. The Hailo-8 is featured in Foxconn’s BOXiedge v2 AI edge server.

Aaeon’s compact, $475 “Boxer-8222AI” embedded box runs Linux on a Jetson Nano along with 4x USB 3.1 Gen2, HDMI 2.0, RS-232, M.2, mini-PCIe, 40-pin GPIO, and 2x GbE ports, one with PoE/PD.

TechNexion’s rugged “EDM-G-IMX8M-PLUS” and “AXON-E-IMX8M-PLUS” modules run Linux on NXP’s 2.3 TOPS i.MX8M Plus with up to 8GB LPDDR4, 16GB eMMC, WiFi/BT, and starter kits. There are also new i.MX8M Mini and Nano EDM modules.

Ibase’s fanless, Ubuntu-ready “ASB200-919” embedded PC is stocked with an 8th Gen UE-series CPU with up to 32GB DDR4, 2x GbE, 2x DP via USB, 4x USB 3.1, and 2x M.2 with NVMe.

Kontron announced three Linux-friendly Elkhart Lake based compute modules with support for optional 2.5GbE: a COM Express Compact Type 6 “COMe-cEL6 (E2)” with up to 32GB DDR4-3200 plus a Mini Type 10 “COMe-mEL10 (E2)” and a “SMARC-sXEL (E2).”

IWave’s “Arria 10 SoC SOM” and “Arria 10 SoC FPGA” dev kit run Linux 4.9.78 on Intel’s hybrid Arm/FPGA Arria 10 GX and SX SoCs along with PCIe, GbE, 10GbE SFP+, FMC, and PMOD.

Advantech’s Linux-ready “SOM-2532” SMARC 2.1 module is built around Intel’s Atom-class, 10nm Elkhart Lake platform and supplies up to 16GB LPDDR4-3200, 256GB UFS 2.1, dual GbE with TSN, dual USB 3.1 Gen 2, dual CAN, and triple 4K support.

Lantronix has launched 50 x 29mm “Open-Q 865XR SOM” and $995 dev kit that runs Android 10 on a 15-TOPS NPU equipped Snapdragon 865 with 6GB LPDDR5, 802.11ax, and triple MIPI-CSI interfaces.

Avalue’s rugged, 3.5-inch “ECM-EHL” runs Linux or Win 10 on an Atom x6000E and offers up to 32GB DDR4-3200, 2.5GbE and GbE, 2x USB 3.1 Gen2, triple 4K displays, and 2x M.2 slots with SIM.

TQ announced four “TQMxE40” compute modules with Intel’s 10nm “Elkhart Lake” Atom x6000E SoCs in SMARC, COM Express Mini Type 10, and Compact Type-6 form factors.

Adlink’s Linux-ready “cExpress-TL” COM Express Compact Type 6 module features the embedded-focused Tiger Lake ULP3 “E” CPUs unveiled by Intel this week. Highlights include 2.5GbE, PCIe 4.0, 4x 4K displays, and AI acceleration.

Toradex has licensed Altium’s online Geppetto embedded board prototyping and design tool for customers using its Arm-based, Linux supported Verdin and Colibri modules.

( Circuit Cellar article) We’re now way past the era when an ordinary camera on a quadcopter style drone is a big deal. Today’s drone cameras are highly sophisticated, with designs evolved for drone use. The latest solutions support thermal imaging, multiple camera streams and more.